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3D Integration & Power Electronics Packaging, Equipment & System
Date: 24 July 2024
Time: 3:30 p.m. – 5:05 p.m
Venue: HKSTP
Details: In the fast-paced world of electronic technology, two groundbreaking innovations are leading the charge: 3D integration technology and power electronics packaging.
3D Integration Technology: By stacking multiple chips vertically, this technology revolutionises system integration and performance. Imagine advanced smartphones, AI servers, and high-performance computing devices that are faster, more efficient, and consume less power – all thanks to 3D integration. With advanced manufacturing processes, we’re seeing more chip layers, tinier components, and superior thermal management.
Power Electronics Packaging: The rise of high-power density semiconductors like silicon carbide (SiC) and gallium nitride (GaN) demands advanced packaging solutions. These techniques boost power density, enhance efficiency, and ensure reliability, making our electronic systems more powerful and dependable.
Together, 3D integration and power electronics packaging are not just trends – they’re the driving forces behind the next wave of technological advancement. They’re pushing electronic systems to new heights of performance, energy efficiency and compactness, fuelling the innovations of tomorrow.
ASTRI brings together three industry experts to explore the exciting prospects of:
Session 1: 3D Precision Measurement Technology Demonstration: Effective Detection of Micro-Structures in the Mid-end Semiconductor Packaging Process
Dr Ethan Yang,Associate Principal Engineer, IoT Sensing and AI Technologies, ASTRI
Session 2: Some Design Considerations in Advanced Packaging for High-Power Electronics
Dr. Mian Tao, Program Manager, HKUST EPACK Lab
Session 3: Generative AI and its impact to advance packaging
Mr. Bill Kong, Business Development Manager, ASMPT Limited
