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3D IC and Electronics Packaging Technologies
Date: 10 September 2024
Time: 2:00 p.m. – 3:30 p.m
Venue: HKSTP
Details: Microelectronics is evolving faster than ever. Two transformative technologies, 3D Integrated Circuits (3D ICs) and innovative Electronics Packaging solutions, are shaping the future of electronics and opening up new possibilities for designing compact, high-performance electronic devices, from our daily appliance to infrastructure.
ASTRI brings together three industry experts to explore how they fuel the next wave of technological breakthroughs, driving progress across a wide range of industries and applications:
Session 1: Trends, Challenges, and Opportunities in Advanced Semiconductors
Dr Daniel Shi, Vice President, Advanced Electronic Components and Systems, ASTRI
Session 2: Evolution of Heterogeneous Integration and System-in-Package Technologies; Past, Present, and Future
Prof. Ricky Lee, Dean and Chair Professor, HKUST (GZ)
Session 3: High Density Bonding Technology Using Low Melting Point Solder for Advanced Packaging Technology
Dr Liu Yingxia, Assistant Professor, The Lab of High Density Bonding Technology and Reliability
Session 4: Advanced Packaging – The Next Big Trend of the Semiconductor Industry?
Mr Wong Yat Yin Isaac, Portfolio Manager, eFusion Capital
