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Technology Application Sharing Session
Exploring the Future of 3D-IC Design and Manufacturing
Title: Exploring the Future of 3D-IC Design and Manufacturing
Date: 2023/7/25
Time: 3:30p.m.-5:05p.m.
Venue: HKSTP
Detail: META, owner of Facebook, just announced their groundbreaking next-gen AI chip, the “MTIA”. These high-performance chips are tailor-made to train AI models and create even better AI systems in the future. It’s clear that chip technology is the key to unlocking the full potential of AI. But where does our chip tech stand now? And how does Hong Kong fit into the world of chip manufacturing?
Don’t miss the chance to join the cutting-edge “Exploring the Future of 3D-IC Design and Manufacturing” tech sharing, brought to you by ASTRI, where four industry titans will come together to tackle these mind-bending questions.
Session 1: Advanced Packaging Technology for Chiplet Integration
Dr Wang Qidong, Director, Packaging and Integration R&D Centre, the Institute of Microelectronics of the Chinese Academy of Sciences
Session 2: The New Role of AI in Transforming Third-generation Semiconductor Integrated Circuit Design
Dr Zhou Xinyu, Research Assistant Professor, Department of Electronic and Information Engineering, Hong Kong Polytenic Univeristy
Session 3: Chemical Additive-Enabled Grain Engineering of Electroplated Copper for Advanced Electronic Packaging Applications
Dr Mu Kaiyu, Manager, Doctech HK Ltd
Session 4: Chiplet, 3D IC, Heterogenous Integration System design challenge and Electronic Design Automation (EDA) Tool Exploration
Dr Zhao Yi, Founder and Chairman, Zhuhai Silicon Chip Technology Ltd
